ADN8810ACPZ-REEL7【PDF 14/16 页】IC CURRENT SOURCE(12BIT) 24LFCSP

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Sheet目录39

10页 11页 12页 13页 [14页]15页 16页

ADN8810

Rev. A | Page 14 of 16

TO OTHER 5V

DIGITAL LOGIC

LOGIC GROUND

RETURN

GND

POWER SUPPLY

ADN8810

AVDD

AVSS

LOAD

GND

IOUT

LOAD

DVDD

PVDD DVSS

DGND

Figure 23. Star Supply and Ground Technique

To improve thermal dissipation, the slug on the bottom of the

LFCSP package should be soldered to the PC board with

multiple vias into a low noise ground plane. Connecting these

vias to a copper area on the bottom side of the board will

further improve thermal dissipation.

Use identical trace lengths for the two output sense resistors.

These lengths are shown as X and Y in Figure 24. Differences in

trace lengths cause differences in parasitic series resistance.

Because the sense resistors can be as low as 1.37 ? small

parasitic differences can lower both the output current accuracy

and the output impedance. Application Note AN-619 shows a

good layout for these traces.

IOUT

TO LOAD

ADN8810

SUGGESTED PAD LAYOUT FOR CP-24 PACKAGE

Figure 25 shows the dimensions for the PC board pad layout for

the ADN8810. The package is a 4 mm ?4 mm, 24-lead LFCSP.

The metallic slug underneath the package should be soldered to

a copper pad connected to AVSS, the lowest supply voltage to

the ADN8810. For single-supply applications, this is ground.

Use multiple vias to this pad to improve the thermal dissipation

of the package.

0.027

(0.69)

0.011

(0.28)

0.020

(0.50)

PACKAGE

OUTLINE

DIMENSIONS ARE SHOWN

IN INCHES AND (MM).

CONTROLLING DIMENSIONS ARE IN MILLIMETERS

0.004

(0.10)

0.827

(2.1) SQ

0.109

(2.78)

0.172

(4.36)

Figure 25. Suggested PC Board Layout for CP-24 Pad Landing

Figure 24. Use Identical Trace Lengths for Sense Resistors

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